[Image Processing Inspection Case] Mapping Inspection of Wafer Ingot
Example of mapping processing! Obtaining the area of each mapping area from the difference area.
We would like to introduce a case of "mapping inspection of wafer ingots" conducted by our company. This process involves dividing the detected area into vertical and horizontal cells and calculating the area within each divided region. This processing is created to gather data on the extent and location of defects, such as cracks and breaks, in the wafer ingot through mapping. You can view an image of the mapping process in the downloadable materials. [Case Overview] ■ Generate mapping areas ■ Virtual defects ■ Synthesize mapping areas and defects ■ Obtain the area of each mapping area from the differential area *For more details, please download the PDF or feel free to contact us.
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