CMP slurry "ClasSiC/GaiN series"
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Designed with abrasive technology and chemical formulation technology! CMP slurry that achieves both high rate and surface quality/surface grade.
Introducing our CMP slurry "ClasSiC/GaiN series." "ClasSiC" is a high-rate slurry specially formulated for chemical-mechanical planarization of SiC substrates used particularly in power devices. "GaiN" is specially designed to optimize the polishing process with nano-alumina abrasives and chemical formulation technology, significantly improving the polishing rate and planarization performance. 【Features】 ■ Achieves higher rates than colloidal silica-based CMP ■ Reduces polishing time ■ Lowers total costs ■ CMP designed with abrasive technology + chemical formulation technology ■ Significantly improves polishing rate and planarization performance ■ Achieves excellent surface finish without scratches or subsurface damage *For more details, please refer to the related link page or feel free to contact us.
basic information
For more details, please refer to the related link page or feel free to contact us.
Price range
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Applications/Examples of results
【Usage】 ■ Used in the CMP process during SiC substrate/GaN substrate processing ■ Compound semiconductor substrate manufacturers ■ Device manufacturers *For more details, please refer to the related link page or feel free to contact us.
