All products and services
31~60 item / All 138 items
-
CO2 Laser Processing Example: Package Substrate Processing
Case study of small diameter hole drilling for package substrates
last updated
-
MACHVISION RtoR LaserVia AOIM
World's top share! Full inspection of hole diameter and residue at the bottom of holes after laser processing!
last updated
-
MACHVISION Hole AOI
World's top share, world standard Hole AOI!
last updated
-
List of FPC manufacturing process inspection equipment manufactured by MACHVISION
We provide various inspection equipment for all manufacturing processes of printed circuit boards!
last updated
-
MACHVISION Circuit AOI 4.0
One unit has the production capacity of five conventional inspection machines!
last updated
-
DLF X-ray multilayer inspection machine
High-precision X-ray inspection equipment for high multi-layer board compatibility!
last updated
-
Laser processing machine - multipurpose single-axis laser processing machine
Multipurpose 1-axis laser processing machine! Development of processing technology for new materials and sales of production machines (custom-made available).
last updated
-
Individual Axis Drive Drill Hole Machine "ECO-DM Series"
High-precision back drilling is possible! Achieving stable high-speed drilling by reducing the weight of movable parts.
last updated
-
Individual Axis Drive Profile Machining Machine 'ECO-RM Series'
Suppresses substrate warping, enabling high-precision notching! Automatic correction for each axis independently during processing.
last updated
-
[Contract Processing] CO2/UV Laser, Drilling, Router *Processing Examples
We also support processing of 5G and IoT-related materials! We can propose technical solutions based on your needs, such as processing with laser composites or performing high-precision back drilling.
last updated
-
Drill hole opening machine with inner layer detection back drill function
■Detect the target inner layer position and perform back drilling based on that position information. ■Stable processing can be carried out while keeping the minimum stub remaining.
last updated
-
CO2 Laser Processing [ABF Resin Direct Processing Results]
■ The densification of package substrates is progressing, and there is a demand for miniaturization using CO2 lasers. ■ Introducing examples of miniaturization processing using our VELA machine.
last updated
-
CO2 Laser Processing [Through-Hole Processing Results]
5G high-frequency compatible products, with APP memory and technologies for thinning and reducing the diameter of the core layer, using CO2 laser drilling techniques for TH holes.
last updated
-
CO2 Laser Processing [Cu Direct Blind Hole Processing Results]
Focus on the micro-diameter processing capability of CO2 lasers and the technology for controlling resin diameter.
last updated
-
UV & CO2 composite laser processing
We are proposing a more reliable laser processing method that leverages the characteristics of both UV lasers and CO2 lasers.
last updated
-
UV laser processing [Router (contour) processing]
■High-quality cutting of multilayer substrates using ultra-small diameter beams is possible. ■Not only linear processing but also processing of irregular shapes including curves is possible.
last updated
-
UV laser processing [Flexible substrate processing]
High-quality blind hole and through hole processing is possible by combining trepanning and punching. Router processing using ultra-small diameter beams is also possible.
last updated
-
UV laser processing [copper foil removal processing]
■ Trepanning processing with a diameter of 25um or more is possible using a very small diameter beam. ■ Punching processing with a minimum diameter of 10um is possible only for thin copper foil.
last updated
-
UV laser processing [Direct processing of ABF material resin]
■ It is possible to process ABF material blind holes with a high taper ratio and uniform hole bottom quality. ■ The minimum hole diameter is φ10um, allowing for control of processing quality.
last updated
-
UV laser processing [High frequency / 5G compatible substrate processing]
We are challenging the processing of new substrate materials compatible with high frequency, 5G, and automotive applications, with the cooperation of substrate material manufacturers and substrate manufacturing companies.
last updated
-
Cylinder for bush changer for hole drilling machine and profile processing machine 2085088
Affordable bush changers available in various types.
last updated
-
Cylinder 2085060 for bush changer for hole drilling machine and profile processing machine
Affordable bush changer cylinders are available in various types.
last updated
-
Cylinder for bush changer for hole drilling machine and profile processing machine 2085046
Low-cost bush changer cylinder - Various types are available.
last updated
-
Cylinder for bush changer for hole drilling machine and outer shape processing machine 2085045
Affordable bush changers available in various types.
last updated
-
Cylinder for Bush Changer for Hole Opening Machine and Profile Processing Machine 2085007
Affordable bush changer cylinders are available in various types.
last updated
-
Floating joint for hole drilling machines and external shape processing machines 2082035
【Bargain】Taiwan-made floating joints ■Available in various types.
last updated
-
CCD sensor for hole drilling and external shape processing machine 2081497
【Affordable】CCD sensors ■Various types are available.
last updated
-
CCD sensor for hole drilling machine and contour processing machine 2081496
【Bargain】CCD sensors ■Various types are available.
last updated
-
BDD Sensor for Hole Drilling Machine and Profile Machining Machine 2081448
【Bargain】 BDD sensors ■ Various types are available.
last updated
-
BDD Sensor for Hole Drilling Machine and Profile Machining Machine 2081447
【Bargain】 BDD sensors ■ Various types are available.
last updated