Efficiency improvement for leveling work during wire cutting "PAD Series" Sales start from December 23, 2021 (Thursday)
大野精工 機工販売事業部
Ono Seiko Co., Ltd. (Headquarters: Nishiō City, Aichi Prefecture, President: Ryutaro Ono) will start selling the leveling base with fine adjustment function for wire cutting, "PAD Series," from December 23, 2021 (Thursday). This product simplifies the leveling required for the preliminary setup of wire cutting, which has previously taken time due to shim adjustments. Our leveling base uses precision steel balls in the adjustment section (patent pending), allowing for easy three-axis adjustments while boasting high durability and precision that is unmatched by competitors. Additionally, by conducting design, manufacturing, and assembly in our own factory, we have been able to reduce costs and achieve a price point that is easy for customers to purchase. In response to customer feedback regarding the lack of need for horizontal adjustments, we will also simultaneously release a type without the Z-axis adjustment function. We aim to provide a leveling base that balances cost and functionality, assisting everyone in improving their operations. Furthermore, we will showcase this product at our booth during the Automotive World event held from January 19 (Wednesday) to January 21 (Friday), 2022. We invite you to check out the "PAD Series" at the venue.
