Support for high-density build-up structures
We can accommodate high-density build-up structures, such as 4-layer full-stack prototypes!
Our company enables the mounting of narrow-pitch components through a high-density build-up structure. In the interlayer thick structure, the interlayer thickness is set to 100-120μm, achieving high insulation reliability. Additionally, we support mass production of three-tier full stacks and skip via structures. Please feel free to contact us when you need our services. 【Specifications Supported】 ■ Narrow pitch support ■ Thick copper foil specifications ■ Mixed IVH & LVH ■ High-frequency support An article about our company has been published in MONOist. 【How we advanced smart manufacturing in a small-lot, diverse-product factory, reducing cumulative hours by 480 over three years】 https://monoist.atmarkit.co.jp/mn/articles/2011/04/news050.html *For more details, please refer to the PDF document or feel free to contact us.
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