Support for high-density components
High-density component mounting such as narrow pitch CSP is possible! We will propose specifications according to your application.
Our company enables high-density component mounting such as narrow-pitch CSP. We offer specifications tailored to applications, including measures to prevent solder blowout during the mounting of via-in-pad structures. Please feel free to contact us when you need assistance. 【Specification Proposals】 ■ Increased wiring density for inner and outer layers → Build-up, IVH structure ■ Measures to prevent solder blowout during the mounting of via-in-pad structures → Pad-on-hole structure ■ High-density CSP mounting with a pitch of 0.65mm or less → Build-up, pad-on-hole structure An article about our company has been published in MONOist. 【How we advanced smart manufacturing in a small-lot, multi-product factory, reducing cumulative hours by 480 over three years】 https://monoist.atmarkit.co.jp/mn/articles/2011/04/news050.html *For more details, please refer to the PDF document or feel free to contact us.
basic information
【Usage Scenarios】 ■Product-specific / Minimum Through Hole Pitch ・Probe Card: 0.65mm ・CSP Main: 0.40mm ・Performance Board: 0.50mm ・Burn-in Board: 0.40mm ■Drilling Specifications ・Minimum φ0.10 to Maximum φ6.2 ■Filling Specifications ・Minimum φ0.15 to Maximum φ0.8 ■Wiring Density (L/S) ・Inner Layer 18μm: 50/50μm 35μm: 60/70μm ・Outer Layer 60μm: 100/100μm *For more details, please refer to the PDF document or feel free to contact us.
Price range
Delivery Time
Applications/Examples of results
For more details, please refer to the PDF document or feel free to contact us.
