Support for large current, high voltage, and high heat dissipation specifications.
We will propose suitable heat dissipation structures, starting with a high current (up to 400A) power supply test!
Our company solves issues related to large currents, high voltages, and heat dissipation through a special structure. We address customer concerns such as defects caused by warping of printed circuit boards due to heat. Please feel free to contact us when you need our services. 【Features】 ■ Capable of conducting large currents (up to 400A) testing ■ Multi-layer structure with conductor thickness up to 500μm ■ Production of metal (with AL 2.5mm) products is possible ■ Proposals for suitable heat dissipation structures Our article has been published in MONOist. 【How we advanced smart manufacturing in a small-lot, diverse-product factory, reducing a cumulative 480 hours over three years】 https://monoist.atmarkit.co.jp/mn/articles/2011/04/news050.html *For more details, please refer to the PDF document or feel free to contact us.
basic information
【Solving the following issues】 ■ Want to carry large currents ■ Assembly labor for busbars is high ■ Issues caused by warping of printed circuit boards due to heat ■ High thermal density, making heat dissipation difficult *For more details, please refer to the PDF document or feel free to contact us.
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Applications/Examples of results
For more details, please refer to the PDF document or feel free to contact us.
