Substrate lineup
Supports specific functional materials such as capacitors and heat dissipation! Balances performance and cost.
We provide printed circuit boards that combine functional materials tailored to various characteristic requirements. By using a hybrid structure of functional materials such as low-loss materials and capacitor materials along with general materials, we achieve a balance between performance and cost. Additionally, we accommodate low-loss materials both domestically and internationally. 【Application Example】 <Embedded Capacitor> ■ Number of Layers: 20 layers ■ Base Material: Faradflex + Megtron6 ■ Application Example: Networks, semiconductor testing *For more details, please refer to the PDF document or feel free to contact us.
basic information
【Other Application Examples】 <Low Loss Material Hybrid> ■ Number of Layers: 38 layers 6.7t ■ Substrate: RO4350B + High-Tg FR4 ■ Application Examples: Antennas, Semiconductor Testing * For more details, please refer to the PDF document or feel free to contact us.
Price range
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Applications/Examples of results
For more details, please refer to the PDF document or feel free to contact us.
