High board thickness and narrow pitch printed circuit board manufacturing technology.
Applicable to semiconductor tester substrates! Achieving narrow pitch printed circuit boards in even higher multilayer and thicker board areas.
Based on the FITT (Fine pitch Through via Technology) method, we are promoting high-precision technology to achieve narrow pitch printed circuit boards in even higher multilayer and thicker board areas. With a board thickness of 7.65mm and a φ0.20 drill through processing, we can accommodate 0.50mm pitch BGA. This technology can be applied to semiconductor tester boards such as load boards, socket boards, and probe cards. 【Features】 ■ Accommodates 0.50mm pitch BGA with a board thickness of 7.65mm and φ0.20 drill through processing - Up to 76 layers ■ Accommodates 0.25mm pitch BGA with ultra-small diameter φ0.10 drill processing - Up to 26 layers with sequential structure possible ■ Achieves narrow pitch BGA compatible boards in even higher multilayer and thicker board areas *For more details, please refer to the PDF document or feel free to contact us.
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