High-density compatible printed circuit board
We can propose specifications tailored to your needs! We provide printed circuit boards with structures customized for your applications.
We provide printed circuit boards with structures tailored to your applications. Increased wiring density for inner and outer layers → Build-up printed circuit boards Implementation of blind vias to prevent solder blowout → Pad-on-hole structure printed circuit boards Pitch of 0.65mm or less → Build-up or pad-on-hole structure printed circuit boards We can propose specifications according to your needs. Please feel free to consult us. 【Usage Scenarios】 ■ By Product / Minimum Through-Hole Pitch - Probe Card: 0.65mm - CSP Main Image: 0.40mm - Performance Board: 0.50mm - Burn-in Board: 0.40mm *For more details, please refer to the PDF document or feel free to contact us.
basic information
【Other Usage Scenarios】 ■ Hole Drilling Specifications - Minimum φ0.10 to Maximum φ6.2 drill ■ Hole Filling Specifications - Minimum φ0.15 to Maximum φ0.8 drill ■ Wiring Density (L/S) - Inner Layer 18μm: 50/50μm - 35μm: 60/70μm - Outer Layer 60μm: 100/100μm ■ Minimum Pad Pitch - 0.15mm pitch / Pad φ0.08 *For more details, please refer to the PDF document or feel free to contact us.
Price range
Delivery Time
Applications/Examples of results
For more details, please refer to the PDF document or feel free to contact us.
