Support for copper coin (thermal dissipation structure) wiring board.
We will introduce methods for heat dissipation in printed circuit boards.
As components and enclosures become smaller, the surface area of components decreases, and the lack of area to dissipate heat from ICs needs to be compensated by the substrate. At Oki Electric Industry, we have realized a structure that locally dissipates heat by embedding cylindrical copper into printed circuit boards, maximizing the thermal conductivity of copper (approximately 390W/m·K). 【Features】 ■ Embedding copper coins in heat-generating areas to efficiently utilize copper's thermal conductivity (390W/m·K) for heat dissipation. *For more details, please refer to the PDF document or feel free to contact us.
basic information
【Heat Dissipation Evaluation by Structure】 <Items/Conditions> ■Humidity: 45% ■Room Temperature: 23℃ ■Power Consumption: 5W ■Temperature Measurement Area: Chip Component *For more details, please refer to the PDF document or feel free to contact us.
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For more details, please refer to the PDF document or feel free to contact us.
