Introduction to printed circuit boards.

We propose highly reliable and high-performance circuit boards that support a wide range of fields, including information communication and industry!

A "printed circuit board" refers to a substrate on which a pattern (electronic circuit) called a pattern is printed on the surface of an insulating board. Our company proposes high-reliability and high-performance substrates tailored to customer requirements, supporting a wide range of fields such as "information and communication," "semiconductor-related," "aerospace," and "industrial." We offer a rich lineup of products, including flexible substrates that achieve space-saving through the reduction of supporting materials, such as "self-supporting sliding FPC," "high-flex FPC," and "high-speed transmission FPC," as well as innovative products with self-supporting and high-flex capabilities. 【Features】 - Lamination, plating, and patterning technologies that support the manufacturing of characteristic impedance-controlled substrates - In-house developed order management systems and design/manufacturing tools that accommodate single prototype and development needs, as well as small to medium volume production of various types - Highly flexible and sliding flexible substrates *For more details, please refer to the external link page or feel free to contact us.

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【Other Features】 ■ High-Precision Plating Technology - Supports high aspect ratio 42 and high multilayer via fill technology ■ High-Precision Patterning Technology - Possesses know-how in exposure, etching, and plating technology, compatible with fine line technology ■ High-Precision Stacking and Drilling Technology - Achieves 0.3mm pitch compatible substrates through the uniquely developed FiTT method ■ High-Density Build-Up Structure - Capable of handling complex structures with "high frequency" + "high density" + "high current" ■ Heat Dissipation Structure with Thick Copper Foil and Copper Coins - Proposes optimal heat dissipation structures to address heat generation issues due to component miniaturization *For more details, please refer to the external link page or feel free to contact us.