High thermal conductivity & electrical insulation one-component room temperature curing adhesive
Contributes to overall cost reduction of equipment, such as reducing assembly man-hours and the number of fixed parts!
This is a one-component, room temperature curing elastic adhesive that highly integrates high thermal conductivity and insulation properties. It improves heat resistance and combustion properties, making it suitable for fixing and bonding complex shapes of thermal transfer sections and heat-generating components, which were difficult with conventional sheet-type heat dissipation materials. It maintains elasticity even after curing, making it less susceptible to the effects of thermal cycles, and being siloxane-free makes it ideal as a heat dissipation material for various electrical and electronic components. 【Features】 - Improved heat resistance and combustion properties - Suitable for fixing and bonding complex shapes of thermal transfer sections and heat-generating components - Good workability, contributing to overall cost reduction of equipment - Maintains elasticity after curing, making it less susceptible to the effects of thermal cycles - Siloxane-free, ideal as a heat dissipation material for various electrical and electronic components *For more details, please refer to the PDF document or feel free to contact us.
basic information
【Product Overview】 ■Base Resin: Modified Silicone ■Tack-Free Time: 10 minutes ■Curing Type: Room Temperature and Humidity Curing Type ■Thermal Conductivity: 2.4 W/m·K ■Volume Resistivity: 4.1×10^11 Ω·cm *For more details, please refer to the PDF document or feel free to contact us.
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Applications/Examples of results
【Applications】 ■ Adhesion of heat dissipation plates or heat sinks to the substrate or surrounding components ■ Alternative to thermal sheets (reduction of labor, addressing concerns about siloxane, etc.) ■ Alternative to thermal grease (improved heat dissipation effect, increased heat resistance, etc.) *Please feel free to contact us.
