Substrate-Incorporated Thin Heat-Resistant Double-Sided Adhesive Tape 'No. 585'
Heat-resistant and anti-rebound, thin double-sided adhesive tape with a substrate that can be used in lead-free soldering processes!
"No. 585" is a thin double-sided adhesive tape that demonstrates excellent adhesion to strong rebound forces such as FPC bending. It can withstand high temperatures in lead-free soldering processes (peak 260°C). It excels in processability and workability during die-cutting operations, particularly in scrap removal tasks. 【Features】 ■ Excellent adhesion to strong rebound forces such as FPC bending ■ Superior processability and workability during die-cutting operations, especially for scrap removal ■ Usable in soldering processes while maintaining the release liner (using heat-resistant release liner) *For more details, please refer to the PDF document or feel free to contact us.
basic information
【Lineup】 ■Double Release Liner Type Product Number: No.585W *For more details, please refer to the PDF document or feel free to contact us.
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Applications/Examples of results
【Applications】 ■ For fixing FPC and housing, for fixing FPC reinforcement plates ■ Other applications requiring heat resistance *For more details, please refer to the PDF document or feel free to contact us.
