End band "Push Mount Tie (Offset) without Wing"
Introducing a cable tie that can be quickly and easily inserted into holes in panels and more!
We handle the 'Push Mount Tie (Offset) without Wing' used for securing wires to chassis, panels, walls, and other surfaces. It can be quickly and easily inserted into holes in chassis panels to secure wire bundles. Since there are no wings on the head, it is suitable for bundling in spaces with limited room. The "T50RSF" accommodates mounting thicknesses of up to 3.1mm. 【Features】 ■ No wings on the head ■ Suitable for bundling in spaces with limited room ■ "T50RSF" accommodates mounting thicknesses of up to 3.1mm ■ Used for securing wires to chassis, panels, walls, and other surfaces *For more details, please refer to the PDF document or feel free to contact us.
basic information
【Lineup】 ■T30RSF ■T50RSF *For more details, please refer to the PDF document or feel free to contact us.
Price range
Delivery Time
Applications/Examples of results
【Usage】 ■When using to secure wires to chassis, panels, walls, etc. *For more details, please refer to the PDF document or feel free to contact us.
Detailed information
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Rheology of Thermoplastic Polymers Using Parallel Plates An example of polyethylene characterized in the temperature range of 160 to 220°C is shown in the figure. Frequency sweep measurements were conducted at multiple temperatures within an experimental range of 0.06 to 628 rad/s. Time-temperature superposition (TTS) was used to extend the data to high or low frequencies and to create a master curve at a permanent reference temperature for applications.
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Rheology of Solid Polymers Using a Torsion Clamp In the ETC oven, viscoelastic property analysis can be performed on solid samples up to 13mm (width) × 50mm (length) × 5mm (thickness). The figure shows an analysis example where a solid ABS sample was subjected to vibrational measurement and temperature scanning from -160°C to 200°C at a rate of 3°C/min. The size and shape of these parameters also depend on characteristics and composition such as crystallinity, orientation, fillers, and crosslinking density.
