We will exhibit at the 2nd Semiconductor Industry Exhibition to be held in Kyushu in 2025.

オルテコーポレーション本社

We are Orte Corporation, a limited company. We will be exhibiting at our booth at the "2nd Kyushu Semiconductor Industry Exhibition," which will be held in Kyushu, a region attracting attention, starting from Wednesday, October 8th. As a specialized manufacturer of collets for chip transport, we plan to showcase a variety of products that meet the needs of advanced assembly processes, including conductive ionizer countermeasure collets and attachment mechanisms for high-aspect and large chips. We will also have sample displays of our products, including collets, so please feel free to stop by our booth. Exhibition Contents: - Pickup collets (rubber/plastic/metal/others) - Ultrasonic cleaning machines and ultrasonic oscillators - Consumables and maintenance parts for semiconductor manufacturing back-end processes (third-party products) - Die bonding-related components (upward needles, dispense nozzles) - Wire bonding-related components (window clampers, finger clamps) - Outsourced cleaning services for parts (capillaries, wedges, maintenance parts) - Transport components (magazine racks, IC chip trays) - Micro 3D printer BMF MicroArch

Date and time Wednesday, Oct 08, 2025 ～ Thursday, Oct 09, 2025
10:00 AM ～ 05:00 PM
Reservation required in advance.
Capital Marine Messe Fukuoka Hall A and B (2-1 Okihama-cho, Hakata Ward, Fukuoka City)
Entry fee Free

Related product information

Prevention of semiconductor chip removal: "Replaceable Rubber Collet"
Standard products available in a variety of sizes, customization is also OK! *Currently offering product samples to 10 people by lottery.

【Minimum Size】*Minimum hole diameter can be 0.076mm or more Round: OD=0.21mm, ID=0.076mm Square: L=0.152mm, W=0.152mm, ID=0.076mm Rectangular: L=0.15mm, W=0.38mm, ID=0.25mm 【Features of Ortec Corporation】 ■ Unique products with excellent functionality, rich experience and track record Specialized knowledge is required for collets used in semiconductor manufacturing equipment such as die bonders and wire bonders. At Ortec, we have numerous achievements in examining engineers' challenges and supporting the introduction of collets. We provide proposals and information necessary for consideration quickly, supporting your success. ■ Providing products that address customer challenges and offer solutions With extensive transaction experience with equipment manufacturers, semiconductor manufacturers, and contract manufacturers, we pay attention not only to your company's benefits but also to the end users beyond that, carefully considering the essence of the challenges and making the perfect proposals. ■ Compliance with regulations on chemical substances contained in products such as RoHS *For more details, please refer to the comprehensive catalog of our products available for download.

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