To those in charge who are struggling with semiconductor chip defects.

Recommended for those who do not understand the reasons for the high number of poor tip takeaways!

"There are frequent errors with chip retrieval, but the cause is unknown." "I want to know how to increase the operating speed of the device and improve production efficiency." Is your company also struggling with such issues? The "rubber collet" handled by Orte Corporation will solve your problems. Please feel free to consult us. 【We can solve the following issues】 ■ I have an idea for a collet, but there are no manufacturers to produce it. ■ Is there a collet for MEMS? ■ I am looking for a collet with suction holes smaller than 0.1 millimeters. ■ There are many defects due to device damage, resulting in poor yield. ■ I am struggling with the pickup of solder balls and bump chips. ■ I cannot find a place that can make collets with special shapes. *For more details, please refer to the PDF document or feel free to contact us.

Related Link - http://www.orute-corp.co.jp/

basic information

**Features of Our Rubber Collet (Excerpt)** - In addition to standard specifications with round, square, and rectangular flat shapes, we design and manufacture custom-made products such as hemispherical shapes, geta shapes, R shapes, long holes, and 2-hole and 3-hole designs to fit the target object. - Developed for chip retrieval measures. - Thin die suction surface grooved collets (CG collets) (square, rectangular) are also available in standard specifications. - Products compatible with ionizer atmospheres. - Sharp-tipped rubber collets for narrow pitch applications. - Custom-made rubber chip contact areas for flip chip bonding solder bump chips, designed to allow suction of edges of small solder bump chips with a contact space width of 0.1mm. - Body types in square and rectangular shapes can also be manufactured. *For more details, please refer to the PDF document or feel free to contact us.*