Are you able to use "truly suitable parts" in semiconductor manufacturing equipment for the backend process?
Examples of solving issues in semiconductor manufacturing equipment, such as "chip scratches and cracks" and "chip carry-back problems during work," with "suitable parts" are presented.
This document is a collection of case studies addressing challenges in semiconductor manufacturing equipment proposed by Orte Corporation, Ltd. It introduces our specialty in consumable parts and presents numerous examples of issues frequently raised by users, such as chip damage, instability problems with dispensers and epoxy transfer, and cases related to torch electrodes for wire bonding. Our company offers a wide range of specifications with distinct features, even in cases where general-purpose parts recommended by equipment manufacturers may not suffice. ◆ We are currently offering a collection of case studies and a comprehensive catalog as a gift! You can view it via PDF download. 【Featured Cases (Excerpt)】 ■ Types of consumable parts ■ Causes and solutions for chip snagging scratches ■ Causes and solutions for cracking (microcracks) ■ Troubles and solutions due to dispenser clogging... ■ Causes and solutions for bonding errors (adhesion failures)... ■ Ultra-precise 3D printed model with a molding resolution of 2μm *For more details, please refer to the PDF document or feel free to contact us.
basic information
【Exhibition Information】 ◆ New Manufacturing and New Services Exhibition for Small and Medium Enterprises Date: December 14, 2022 - December 16, 2022 Venue: Tokyo Big Sight, East Hall 7 Exhibition Zone: Machinery and Parts Booth Number: D50 ◆ 37th Nepcon Japan - Electronics Development and Implementation Exhibition Date: January 25, 2023 - January 27, 2023 Venue: Tokyo Big Sight Booth Number: 26-36 【What We Can Do】 The specifications of consumable parts vary due to the conditions and environments shown below. ■ Products eligible for pickup ■ Regarding chip shapes (external dimensions, thickness, other features, bumps, etc.) ■ Machines that will introduce our collets (manufacturer and model number, etc.) ■ Error detection methods (vacuum detection, optical detection, etc.) ■ Usage environment, such as temperature (consideration of heat resistance, etc.) ■ Applications and usage processes of our products (die attach, transfer to trays or packages, etc.) ■ Currently used collets (material, manufacturer, size, model number, etc.) ■ Background leading to the consideration of our products this time *For more details, please refer to the PDF materials or feel free to contact us.
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For more details, please refer to the PDF document or feel free to contact us.
