We also provide design support for bonding device components that are no longer in production by the manufacturer.
Flexibly respond to the manufacturer's discontinuation of bonding products.
We offer a wide range of products from die bonding to wire bonding. Even if production has ended at each manufacturer, we will design the products in-house. We also persistently solve issues such as electrical characteristic defects. Inquiries regarding product optimization and longevity are also welcome.
basic information
Bonding Products "Die Bonding" - Epoxy Dispensing Nozzle / Dispense Nozzle - Custom Dispense Nozzle - Stamping Tool (Transfer Pin) - Spanker Head "Wire Bonding" - Spark Electrode for Wire Bonder / EFO Torch - EFO Torch Assembly - Wedge - Shear Tool / Pull Hook - Window Clamp / Heat Block - Finger Clamp / Anvil Block
Price range
Delivery Time
Applications/Examples of results
Epoxy Dispensing Nozzle / Dispense Nozzle We will design the optimal solution to issues such as unstable epoxy application amounts like tailing, bridging, and voids. The dispense nozzle can be proposed in single/multi-nozzle configurations according to the requirements of the process, application, or application pattern. It is well-received for its superior stability in application and maintenance compared to genuine parts that come with the equipment. The minimum inner diameter is available from φ0.08mm. Spark Electrode for Wire Bonder / EFO Torch Using platinum electrodes with excellent electrical properties allows for good current density. Additionally, materials like Ir (iridium), Cu (copper), and Ag (silver) are used, and platinum has a high heat resistance, resulting in less wear due to oxidation, making it cost-effective and extending its lifespan. We can accommodate manufacturers such as ASM, K&S, ESEC, Shinkawa, and KAIJO. The EFO torch (electrode torch) is used in the wire bonding process. We design and provide a wide range of EFO torches for wire bonders used in the semiconductor industry.
