An innovative performance evaluation method to eliminate defects and damaged semiconductor chips.
Innovative semiconductor manufacturing technology that paves the way for the future! The ultimate performance evaluation methods and products that eliminate defects and flaws to zero.
Orte's collet helps improve chip defects. By selecting appropriate materials and designs based on chip quality, we achieve the complete elimination of carryover errors and scratches! Customizations and designs tailored to your manufacturing equipment are also available upon request.
basic information
Evaluation Methods Electrical Property Measurement Using Electron Beam Technology By conducting electrical property measurements utilizing electron beam technology in addition to conventional SEM, it becomes possible to accurately identify defects that were difficult to detect with traditional methods. Through electrical property measurements, issues related to the electronic performance of semiconductor chips can be understood, allowing for the formulation of improvement strategies. Transistor Measurement Using Nano-Probe Technology By introducing nano-probe technology, it is possible to directly measure transistors using miniaturized probes. This innovative method is primarily utilized for failure analysis. By accurately detecting defects and damages in the fine parts of transistors, it can lead to improvements in the manufacturing process. Capacitance Measurement Using Electron Beam Technology Using electron beam technology, it is possible to determine the surface charge of a sample. By estimating the resistance and capacitance values of the equivalent circuit using this method, defect locations can be identified. This approach is particularly effective in discovering defects in fine circuits without missing them, contributing to the enhancement of product reliability.
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Even from a distance, we will thoroughly refine your company's concerns through video calls and work together until the end on improvements related to semiconductor manufacturing. Our company has achieved the elimination of scratches on chips and improved the carry-out error rate of semiconductor chips to 0%.
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