Technology that enables the transport of semiconductor chips with thorough injury prevention.
We uniquely design and manufacture the material, hardness, and tip shape of the collet to match the material and manufacturing environment of semiconductor chips.
■Materials for Collets that Can Be Manufactured - Carbide Die Collets - Resin Collets - Rubber Collets (Nitrile Rubber, Fluoro Rubber, Silicone Rubber) - Ceramic Collets - Porous Material Collets - Next-Generation Resin New Materials ■Available Shapes - Pointed Tip - Square - Special Shapes - 3D Printed Nozzles
basic information
We prevent scratches on the chips and eliminate all factors that can degrade product quality, such as dents. By designing an appropriate collet, we can cut extra costs like reproduction and electricity, making it possible to improve production performance compared to conventional methods.
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Applications/Examples of results
Although there were concerns about an error rate of around 60% with conventional collets, we have improved it to nearly 0% by replacing them with our pickup tools. Our company conducts daily research on collet design and 3D printing, and we can flexibly accommodate the latest materials and designs with special shapes.
