Machining Examples | Round Ring Parts for Semiconductor Manufacturing in SUS316 Stainless Steel
Simultaneous processing of stainless materials such as SUS316 using CNC lathes and machining centers. Manufacturing high-precision ring parts for semiconductor production.
We would like to introduce a case study of high-precision stainless steel ring components used in the mechanical parts of semiconductor manufacturing equipment. Stainless materials such as SUS316 are simultaneously processed using a CNC lathe and machining center, with a size of φ220×30mm. This processing not only enhances aesthetic appeal but also demonstrates practical benefits such as heat dissipation, adjustment of sliding resistance, and visual functional separation. The spiral shape is achieved by effectively utilizing both NC lathes and machining centers, allowing for the coexistence of high-precision rotationally symmetrical shapes and intricate design processing. 【Case Overview】 ■ Industry: Semiconductor Manufacturing Equipment ■ Processing Method and Process: Simultaneous processing using CNC lathe and machining center ■ Product Size: φ220×30mm ■ Lot Size: 1 to 10 pieces *If you are wondering whether such processing is possible, please feel free to contact us. ~ For complex shape processing using NC lathes and machining centers, contact Ootone Seiki ~
basic information
For more details, please feel free to contact us.
Price range
Delivery Time
Applications/Examples of results
For more details, please feel free to contact us.
