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Film composite material "Film Pochicon"

Challenging new possibilities for films with low linear expansion and high rigidity! It also has good adhesion properties for secondary processing and metals.

"Film-grade Pochicon" is a composite material for recyclable thermoplastic films, created by combining a special scaly "filler" with thermoplastic resin, offering low thermal expansion coefficient and high rigidity. Due to its low thermal expansion coefficient and good adhesion properties for secondary processing and metals, its applications extend to flexible substrates and multilayer boards. 【Features】 ■ High rigidity, bend resistance, and surface smoothness ■ Recyclability and low thermal expansion coefficient ■ Thermoplastic: easy secondary processing ■ Solder heat resistance 260°C for 60 seconds ■ Excellent dielectric properties ■ Low thermal fusion at 250°C *For more details, please refer to the PDF document or feel free to contact us.

Related Link - https://www.otsukac.co.jp/products/chemical/terraf…

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For more details, please refer to the PDF document or feel free to contact us.

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【Applications】 ■ Insulation sheets, belts, tubes ■ Speaker diaphragms ■ Materials for multilayer substrates ■ Coverlay ■ Materials for flexible connection substrates *For more details, please refer to the PDF document or feel free to contact us.

Otsuka Chemical PRODUCT INFORMATION Catalog

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