Puriken Co., Ltd. Printed Circuit Board Patterning (Inner Layer)
Implemented in the press room, developing room, and clean room! Introducing our process equipment.
Our company performs "patterning (inner layer)" using process equipment. In the press room, we check the inner layer pattern with an X-ray drilling machine and create reference holes. In the developing room, we clean the boards cut to specified sizes and improve the adhesion of the dry film. In the clean room, we peel off the polyethylene film with an auto-laminating cutter while pressing it with a heat roll to ensure adhesion between the film and the substrate, followed by exposure to ultraviolet light. In the developing room, we swell and peel off the unexposed areas. [Process] ■ Reference hole processing ■ Surface leveling ■ Exposure ■ Development *For more details, please refer to the PDF document or feel free to contact us.
basic information
【Exposure Equipment】 ■Automatic Integration Exposure Machine ■Direct Exposure Device *For more details, please refer to the PDF document or feel free to contact us.
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For more details, please refer to the PDF document or feel free to contact us.
