PuriKen Co., Ltd. Printed Circuit Board Resin Filling
After drilling, there is a process of resin filling and lid plating following copper plating!
Our company performs "resin filling" using process equipment. Conductive metal and non-conductive non-metal pastes are applied to the surface of the substrate, and after being embedded in the holes, they are printed using a screen plate. By overheating and curing the resin, and then performing lid plating after polishing, a flat surface is achieved. 【Process】 1. Drilling 2. Copper plating 3. Resin filling 4. Lid plating *For more details, please refer to the PDF document or feel free to contact us.
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Our company was established in 1977 as a specialized manufacturer of printed circuit boards. Under a thorough delivery management system unique to our company, we achieve a wide variety of products with short delivery times, providing consistent services through a network that has strengths in various sales locations and regions. Please feel free to contact us if you have any inquiries.