Puriken Co., Ltd. Printed Circuit Board Patterning (Outer Layer)
After the finishing in the developing room and the process in the clean room, it will be developed in the developing room!
Our company performs "patterning (outer layer)" using process equipment. In the clean room, to protect the through-hole plating, after forming the through-hole with copper plating, a photosensitive dry film is applied. The film is adhered to the substrate, and after exposure to ultraviolet light, the unexposed areas are swollen and removed in the developing room. 【Features of Photosensitive Dry Film】 ■ Photosensitive resist in film form ■ Sandwich structure sandwiched between polyester film and polyethylene film *For more details, please refer to the PDF document or feel free to contact us.
basic information
【Process】 ■Whole surface ■Exposure ■Development *For more details, please refer to the PDF document or feel free to contact us.
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For more details, please refer to the PDF document or feel free to contact us.
