Purikenn Co., Ltd. Printed Circuit Board Etching (Outer Layer)
Chemically dissolve the unnecessary copper! After completing the conductor pattern, peel off to reveal the copper foil pattern.
Our company performs "etching (outer layer)" using process equipment. In the plating room, the unnecessary parts of the copper are chemically dissolved. After etching and completing the conductor pattern, the etching resist (partial protective mask) is no longer needed, so it is removed, resulting in the copper foil pattern. 【Process】 ■ Etching ■ Stripping *For more details, please refer to the PDF document or feel free to contact us.
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