PuriKen Co., Ltd. Free Webinar on Printed Circuit Boards
Is it still getting smaller? Trends in power electronics technology visible from the disassembly of the power control unit of the new Prius - Miniaturization technology 'busbar' and more.
We will hold a free webinar titled "Is it still getting smaller? Trends in power electronics technology revealed through the disassembly of the new Prius power control unit." In this webinar, we will provide insights into the challenges faced by power electronics engineers and potential solutions. Additionally, we will discuss trends in power electronics miniaturization technology, the effectiveness of front-loading development methods, and how Scideam reduces simulation time (developed by the Smart Energy Research Institute). We will also introduce the combination of printed circuit boards and busbars as a miniaturization technology for high-voltage and high-current printed circuit boards. [Webinar Overview] ■ Date and Time - Day 1: July 16 (Tuesday) 11:00-12:00 - Day 2: July 23 (Tuesday) 11:00-12:00 ■ Organized by - Ryosan Co., Ltd. *For more details, please refer to the related link URL below or feel free to contact us.
basic information
【Products Offered】 <PCB (AW) Design> ■ In-house CAD system ■ Digital, analog, high-frequency, power supply <PCB Manufacturing> ■ Single-sided, 2 to 24-layer boards, build-up, special boards ■ Various substrate materials (high-frequency, high current, metal, etc.) <Component Assembly> *Handled by partner companies ■ SMT, DIP, wire bonding ■ Rework tasks, component procurement *For more details, please refer to the PDF document or feel free to contact us.
Price range
Delivery Time
Applications/Examples of results
【Achievements (Partial)】 ■ Product Applications: Power supplies, measurement, motors, video, communication, audio, sensors, and others ■ Board Specifications: Single-sided, 2 to 24 layers, build-up, special boards, compatible with various materials ■ High-speed Signal & High-frequency Circuits: 4K and 8K video equipment, medical cameras, wireless devices, various antennas ■ High Current & High Heat Dissipation: UPS uninterruptible power supplies, battery packs, various in-vehicle ECUs, lighting equipment ■ Others (Multi-factor): Production jigs (inspection jigs), components & semiconductors (evaluation & packaging), and others *For more details, please refer to the PDF document or feel free to contact us.
