Purikenn Co., Ltd. Printed Circuit Board Solder Resist Formation Technology
Microscopic openings and high-precision alignment! Formed by direct imaging method.
Smartphone chip components are becoming increasingly smaller, and product testing for 0201 sizes is actively being conducted. In printed circuit boards, the formation of micro-openings and the ability for high-precision alignment are becoming important. At Priken, we provide substrates that achieve both micro-openings and high positional accuracy by forming solder resist openings using direct imaging methods. Please feel free to contact us if you have any requests. 【Specifications】 ■ Minimum opening size: Φ70±5μm ■ Pattern/resist clearance: 20μm ■ Mask film-less *For more details, please download the PDF or feel free to contact us.
basic information
For more details, please download the PDF or feel free to contact us.
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Applications/Examples of results
【Usage】 ■0201 Chip Component Mounting Pad *For more details, please download the PDF or feel free to contact us.
