PuriKen Co., Ltd. - A substrate that dissipates heat faster from printed circuit boards.
A suitable design! We propose a substrate that dissipates the heat from the heating element more quickly.
We would like to introduce our "substrate that dissipates heat faster." With the emergence of high-output power semiconductors, new implementation methods and thermal management strategies are required. From the perspective of printed circuit board manufacturing, we propose a substrate structure that can dissipate heat more quickly. Additionally, we customize the substrate to optimize the arrangement and shape of thermal vias according to usage, allowing for greater heat dissipation. 【Features】 ■ Simple thermal calculations conducted from the perspective of substrate manufacturing ■ Suitable designs presented based on calculation results ■ Proposals for substrate structure and heat dissipation strategies by our technical department *For more details, please download the PDF or feel free to contact us.
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