Announcement of a Free Webinar on Printed Circuit Boards
Announcement of Webinar / September 9 (Tuesday) 11:00 AM - 12:00 PM 【A Rough Method for Estimating the Heat Dissipation Copper Foil Area of Printed Circuit Boards!!】
A Rough Method for Estimating the Heat Dissipation Copper Foil Area of Printed Circuit Boards!! In cases where there are components or circuit configurations that may generate heat, and new or unknown factors necessitate heat countermeasures, delays or failures in design responses can occur due to a lack of experience in thermal design or the absence of analysis tools. This can lead to problems in actual devices and delays in development schedules. To conduct thermal analysis, tools are typically required, but many do not have the necessary resources, and hiring specialized firms can often be costly. In this webinar, we will introduce heat countermeasure techniques that can be implemented even when there is no time or budget for simulations. ■ Recommended for: - Engineers dealing with components or circuits where heat generation is a concern, such as power circuits, motor control, and LED boards. - AW designers ■ Date: Tuesday, September 9, 2025, 11:00 AM - 12:00 PM ■ Format: Webinar (using Zoom) ■ Organized by: Ryosan Corporation ■ Co-organized by: Priken Corporation ■ Participation Fee: Free *For more details, please refer to the related link URL below or feel free to contact us.
basic information
【Products Offered】 <PCB (AW) Design> ■ In-house CAD system ■ Digital, analog, high frequency, power supply <PCB Manufacturing> ■ Single-sided, 2 to 24-layer PCBs, build-up, special PCBs ■ Various substrate materials (high frequency, high current, metal, etc.) <Component Assembly> *Handled by partner companies ■ SMT, DIP, wire bonding ■ Rework tasks, component procurement *For more details, please refer to the PDF document or feel free to contact us.
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Applications/Examples of results
【Achievements (Partial)】 ■Product Applications: Power supply, measurement, motors, video, communication, audio, sensors, others ■Board Specifications: Single-sided, 2 to 24 layers, build-up, special boards, compatible with various materials ■High-speed Signal & High-frequency Circuits: 4K and 8K video equipment, medical cameras, wireless devices, various antennas ■High Current & High Heat Dissipation: UPS uninterruptible power supplies, battery packs, various in-vehicle ECUs, lighting equipment ■Others (Multi-faceted): Production jigs (inspection jigs), components & semiconductors (evaluation & packaging), others *For more details, please refer to the PDF document or feel free to contact us.
