Technical Document on Solder Resist Formation for Smartphones
We present materials that are helpful for high-density smartphone circuit board design!
In the smartphone industry, high-density mounting of printed circuit boards is required due to miniaturization and increased functionality. It is particularly important to enhance the component placement density within limited space and ensure the reliability of electrical connections. Proper design of solder resist is essential for solving these challenges. Our materials on solder resist formation technology support the optimization of design for high-density mounting. 【Usage Scenarios】 - Design of high-density mounting boards - Optimization of component placement - Improvement of electrical connection reliability 【Effects of Implementation】 - Increased efficiency in board design - Miniaturization and high performance of products - Improved yield
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【Features】 - Specifications such as terminal size, clearance, and solder mask thickness are provided. - Compatible with SMD and NSMD. - Detailed information can be confirmed in the documentation. 【Our Strengths】 We provide total support for the design, manufacturing, component mounting, and metal mask production of printed circuit boards. Since our establishment in 1977, we have achieved small-lot production of a wide variety of products and quick delivery times to meet our customers' needs.
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Our company was established in 1977 as a specialized manufacturer of printed circuit boards. Under a thorough delivery management system unique to our company, we achieve a wide variety of products with short delivery times, providing consistent services through a network that has strengths in various sales locations and regions. Please feel free to contact us if you have any inquiries.