Solder resist formation technology for wearable devices
Specifications for terminal size, clearance, and solder mask thickness are provided.
In the wearable device industry, miniaturization and high-density mounting are required, making space-saving in circuit board design an important challenge. Solder resist formation technology enhances the mounting density of components and contributes to the overall miniaturization of devices. Our materials on solder resist formation technology are useful for product selection. [Usage Scenarios] - Miniaturization of wearable devices - High-density mounting - Protection of components [Effects of Implementation] - Miniaturization of devices - Improved reliability - Increased design flexibility
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【Features】 - Specifications such as terminal size, clearance, and solder mask thickness are listed. - Supports SMD (Solder Mask Define) and NSMD (Non-Solder Mask Define). 【Our Strengths】 We provide total support for the design, manufacturing, component assembly, and metal mask production of printed circuit boards. We achieve a wide variety of products with short delivery times and offer consistent services through a network with regional strengths.
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Our company was established in 1977 as a specialized manufacturer of printed circuit boards. Under a thorough delivery management system unique to our company, we achieve a wide variety of products with short delivery times, providing consistent services through a network that has strengths in various sales locations and regions. Please feel free to contact us if you have any inquiries.