Technical Document on Solder Resist Formation for Communication Infrastructure
Specifications such as terminal size, clearance, and solder mask thickness are listed.
In the telecommunications infrastructure industry, particularly in the field of signal integrity, the reliability of printed circuit boards is crucial. To ensure accurate signal transmission, precision in component placement on the board is required. Proper design and formation of solder resist prevent short circuits and disconnections, contributing to the long-term stability of the product. Our materials on solder resist formation technology are helpful during product selection. 【Usage Scenarios】 - PCB design for communication devices - Protection of signal transmission paths - Shielding of high-frequency circuits 【Benefits of Implementation】 - Improved board reliability - Increased product lifespan - Stabilization of signal quality
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【Features】 - Specifications such as terminal size, clearance, and solder mask thickness are provided. - Supports SMD (Solder Mask Define) and NSMD (Non-Solder Mask Define). - Provides information useful for product selection. 【Our Strengths】 We provide total support for the design, manufacturing, component assembly, and metal mask production of printed circuit boards. We are capable of small-batch production with a wide variety and quick delivery times.
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