Thin QFN package power module
Shield inductor embedded module! Suitable for applications with space constraints.
Rikei Corporation offers the RPX-2.5 module, one of the smallest in its class, which is a low-profile QFN package step-down regulator power module manufactured by RECOM. It boasts very high output density and improved thermal management thanks to flip-chip technology. 【Features】 ■ Shielded inductor integrated module ■ Thermally enhanced low-profile QFN package measuring 4.5mm x 4mm x 2mm ■ Suitable for applications with space constraints ■ Various protection features (SCP, OCP, OTP, OVP, UVLO) ■ Efficiency of 91% *For more details, please refer to the PDF document or feel free to contact us.
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【Other Features】 ■ Thermally optimized through flip chip technology ■ Evaluation board also available *For more details, please refer to the PDF document or feel free to contact us.
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For more details, please refer to the PDF document or feel free to contact us.
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Rikei Corporation was established in 1957 and is a solution vendor in the IT and electronics industry, celebrating its 65th anniversary. We propose a variety of solutions centered around cutting-edge technologies and advanced products in the fields of system solutions, network solutions, and electronic components and devices, tailored as the optimal "step-ahead solution" to meet our customers' needs.