High heat resistance, high humidity resistance, flexible epoxy adhesive St8838
A one-component black epoxy that balances high temperature and humidity resistance with flexibility, suitable for jet dispensing, reflow, and low halogen, ideal for bonding/protecting electronic components.
One-component black epoxy that balances high temperature and humidity resistance with flexibility. With a Shore hardness of D15 to D25, it is flexible yet strong against heat and high temperature and humidity. It has proven resistance to temperature cycle tests from -40°C to 105°C and high temperature and humidity tests at 85°C and 85% humidity. Work life is 72 hours, and it has excellent viscosity stability. It is suitable for bonding/protecting electronic components with reflow compatibility and low halogen content.
basic information
Heating curing conditions (for 2g) @80°C / 30 minutes @130°C / 10 minutes @150°C / 5 minutes Physical properties (reference values) Viscosity: 6,500 - 7,500 [mPas] Tg: 15~25℃ CTE (below Tg): 17 [ppm/K] CTE (above Tg): 312 [ppm/K]
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Applications/Examples of results
Protection encapsulation and potting sealing of electronic components Adhesion of MEMS mirrors
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Rikei Corporation was established in 1957 and is a solution vendor in the IT and electronics industry, celebrating its 65th anniversary. We propose a variety of solutions centered around cutting-edge technologies and advanced products in the fields of system solutions, network solutions, and electronic components and devices, tailored as the optimal "step-ahead solution" to meet our customers' needs.