Adhesive for fiber assembly
Acquired low outgassing standards, 85℃ 85% RH resistance, No.1 share in ferrule assembly. Products with high Tg at low temperatures and short durations, excellent workability.
Optical communication, laser, products for glass/plastic fibers ◆ Heat-curing adhesive EPO-TEK 353ND Obtained NASA low outgassing standard (NASA ASTM E595) Outgassing below 0.1% under Telcordia(r) GR-1221 conditions Excellent high temperature and high humidity (85℃ 85% RH) and temperature cycling resistance High adhesion strength, usable with minimal application ◆ Low temperature/short time, high Tg EPO-TEK OE184 Short curing derivative of 353ND Usable at 80℃ for 25 minutes to 150℃ for 1 minute High Tg product at low temperature/short time curing Outgassing below 0.1% under Telcordia(r) GR-1221 conditions * In addition to adhesive sales, Rikei can consistently propose everything from fiber customization to termination processing, arraying, bundling, and high-power connector assembly. Please feel free to contact us if you have any issues related to optical fibers.
basic information
【353ND】 Recommended curing conditions: 150℃/1hr Other curing temperatures: 80℃~150℃ Viscosity: 3,000~5,000 cps Tg: above 90℃ 【OE184】 Recommended curing conditions: 150℃/1hr Other curing temperatures: 80℃~150℃ (short-term curing possible) Viscosity: 3,000~4,000 cps Tg: above 100℃
Price range
Delivery Time
Applications/Examples of results
Fiber assembly (ferrule assembly), connectorization, etc., optical communication.
