Epoxy for laser diode die attach
Low outgassing, low-temperature curing, and the ability to determine the presence of curing based on color after curing!
- An insulating epoxy that combines high heat dissipation and low curing shrinkage. - Good adhesion to non-ferrous metals such as aluminum, copper, and nickel. - Low outgassing minimizes contamination of LD. - Can cure at low temperatures (80°C). - Uses boron nitride filler for high thermal conductivity. - Curing status can be confirmed (before curing: off-white, after curing: amber). - Both two-component (room temperature storage) and one-component (frozen storage) options are available.
basic information
Product Name: EPO-TEK(r) 930-4 【Basic Physical Properties】 - Curing Temperature: 80℃ to 150℃ - Viscosity: 12,000-17,000 cPs - Die Shear Strength: 36.7 MPa - Thermal Conductivity: 1.7 W/mK *Measurement: Laser Flash Method - Filler Used: Boron Nitride
Price range
Delivery Time
Applications/Examples of results
<Application> - Laser processing machine - Optical communication hybrid package, etc. <Applications> - LD die attach - Heat sink assembly - Adhesion with non-ferrous metals such as aluminum, nickel, and copper - Good compatibility with ceramics, glass, and many plastics
