Difficult-to-attach material for Structalit(r) X-1320419
Epoxy adhesive ideal for bonding polyamide (PA) and liquid crystal polymer (LCP)!
- One-component, long working time, good workability (working time guideline: 48 hours) - Curing shrinkage rate: less than 0.5% = reduced stress on the device - Can be cured at 80°C to 120°C - Good adhesion to PEEK and polyimide (PI) - We also handle adhesion of other metal components.
basic information
Due to its flexibility, it can also be used for bonding dissimilar materials. It is suitable not only for adhesive applications but also for protective applications such as casting and potting. 【Basic Properties】 Number of components: 1 component (Storage temperature: -20°C) Curing conditions: 80°C for 1 hour or 120°C for 30 minutes Viscosity: 5,000 - 6,000 cPs (similar to loose honey) Tg: 90°C to 115°C Operating temperature range: -40°C to 200°C Coefficient of linear expansion: Below Tg: 27 ppm, Above Tg: 193 ppm
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Applications/Examples of results
Panacol is based in Germany and offers a lineup of heat-curing, UV-curing, UV+heat, and instant adhesives for automotive, medical, and consumer goods sectors. In particular, the Structalit(r) series, primarily featuring one-component epoxy, has a proven track record in applications requiring durability, such as sensors for automotive use and endoscopes for medical applications. The Structalit(r) X-1320419 introduced here has a proven track record for bonding difficult-to-adhere materials, such as polyamide (PA) and liquid crystal polymer (LCP), which are increasingly used nowadays.
