Formic acid reduction vacuum reflow furnace
Formic acid molecules approach the work surface and actively remove (reduce) the oxide film.
We would like to introduce our "Flux-less Vacuum Reflow." Instead of flux, formic gas removes the oxide film on the metal surface, eliminating the need for flux cleaning in subsequent processes. (When using solder foil, dedicated paste, etc.) Additionally, by utilizing vacuum and re-pressurization, it effectively reduces solder splash and voids. 【Features】 ■ Direct vaporization of formic acid - High-speed vaporization (4g/sec) - No carrier gas required ■ High-speed heating through radiant heat - Maximum temperature: over 400℃ - High heating efficiency due to radiant heat *For more details, please download the PDF or feel free to contact us.
basic information
【Other Features】 ■ Safe supply and discharge of formic acid - Equipped with our proprietary formic acid decomposition treatment unit - Completely harmless treatment of formic acid in exhaust → No exhaust treatment equipment required *For more details, please download the PDF or feel free to contact us.
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For more details, please download the PDF or feel free to contact us.
