Mechatronics Tech Japan 2011 (abbreviated as MECT2011) Exhibition Information

榮製機

~We will assist with Japanese manufacturing!~ We are pleased to announce that Eiseiki Co., Ltd. will be exhibiting at "Mechatrotech Japan 2011 (abbreviated: MECT2011)." Our new wire-cut bridge allows for horizontal leveling of large workpieces and can reduce setup time. The precision grinding cylindrical device can process round pins and perform pin machining while rotating on a profile grinding machine. ■ Dates: September 29 (Thursday) to October 2 (Sunday) - 4 days ■ Venue: Port Messe Nagoya (Nagoya International Exhibition Center) Halls 1, 2, and 3 ■ Booth Number: 1D19 【Main Exhibited Products】 - Wire-cut Bridge (NEW) - Wire-cut Vise - Punch Index (with two-axis adjustment function) (NEW) - Precision Grinding Cylindrical Device (NEW) - Precision Vise We look forward to your visit. *For more details, please contact us directly.

This is a product image of a wire-cut bridge.

This is a product image of a precision grinding cylindrical device.

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Related product information

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With a hold-down clamp, there is no lifting of the workpiece during chucking!

【Specifications】 <PV-20 Mini Vice> ■ Maximum opening of the jaws: 20mm ■ Width of the jaws: 25mm ■ Width and depth of the sub-groove: 1.5mm ■ Depth of the jaws: 10mm ■ Weight: 0.3kg ■ Accuracy 　・Parallelism, perpendicularity: within 0.002mm *For more details, please refer to the PDF document or feel free to contact us.