Overseas manufacturing of advanced PCBs (printed circuit boards) for aerospace, medical devices, communication equipment, etc.

We have strengths in advanced technology for high multilayer and ultra-fine pitch developed for aerospace applications, and we respond to the needs for procuring advanced substrates overseas.

We would like to introduce our overseas manufacturing of advanced PCBs (printed circuit boards) for aerospace, medical devices, communication equipment, and more. Our company is a PCB manufacturing company with a long track record of providing PCB solutions for major markets in high-speed telecom, networking, computing, ATE, mission-critical defense and aerospace (MIL-PRF-31032, AS9100), automotive, and medical sectors. 【Features】 ■ Global footprint (two locations in the U.S., four factories in Singapore and China) ■ Design for PCB layout, CAD, productivity improvement, and cost reduction ■ Complete NPI support ■ Material technology ■ Technical leadership (multilayer boards, HDI, etc.) 【We will be exhibiting at NEPCON Japan 2025!】 Date: January 22 (Wed) - 24 (Fri), 2025, 10:00 AM - 5:00 PM Venue: Tokyo Big Sight (Booth # E28-17) *Please register your visit via the link below and stop by our booth! (No waiting time)

NePCON Japan Admission Badge Registration Form

basic information

【Other Features】 ■ Over 20 process and product patents ■ Large panels up to 42 inches, +70 layers, 400 mil thickness ■ Extremely small pitch (2/2 mil line and space) ■ High aspect ratio (>30:1) with complex waveform RPP plating ■ Advanced PCB capabilities at the Costa Mesa facility (USA) *For more details, please download the PDF (English version) or feel free to contact us.