Improving productivity with instant bonding! Hot melt adhesive for electronic components.
It is possible to improve productivity due to low cost and a short curing time until the initial strength develops! 【Also compliant with RoHS2】
This is a product handled by Sanyo Life Materials Co., Ltd. For inquiries, please call 03-3518-2193. Our "Hot Melt Adhesive" offers lower costs and shorter curing times until initial strength is achieved compared to conventional silicone adhesives and epoxy resins, thus improving productivity. Additionally, it complies with the latest RoHS2 standards, allowing for safe use. We offer a variety of distinctive product numbers, including high heat-resistant types and flame-retardant types that have obtained UL94V-0 certification. By combining with a wide range of hot melt guns, we propose suitable solutions for various applications. 【Features】 ■ Low cost ■ Complies with RoHS2 ■ Short curing time ■ Siloxane-free 【Applications】 ■ Vibration reinforcement of components on circuit boards ■ Encapsulation of circuit boards and components ■ Bundling and fixing of cables ■ Potting and sealing, etc. *For more details, please download the PDF or contact us.
basic information
For more details, please download the PDF or contact us.
Price range
Delivery Time
Applications/Examples of results
【Applications】 ■ Vibration damping reinforcement for components on the circuit board ■ Encapsulation of the circuit board and components ■ Bundling and securing of cables ■ Potting and sealing, etc.
