Dry-type dicing saw circuit board cutting machine 'SAM-CT1520D' *Test cutting

Cutting the substrate with the blade rotating at a high speed of up to 200mm/sec! No need for water or fixing UV tape, reducing costs.

The dry-type dicer SAM-CT1520D achieves sharp cutting surfaces without applying stress by rotating the blade at high speeds to cut the substrate. (Cutting speed: 20mm/sec to 200mm/sec, Cutting width: 0.1mm to 0.5mm) Thanks to a powerful dust collection system, the adhesion of chips to the substrate is minimal. Since it does not use water, there is no need for water supply and drainage facilities, making it environmentally friendly and reducing running costs. *Test cutting is also available* 【Features】 ■ High-speed, high-precision cutting ■ Environmental measures and reduction of running costs ■ Safe cutting and workpiece decharging ■ High operability *For more details, please download the PDF document or feel free to contact us.*

basic information

【Other Features】 - By rotating the blade at high speed to cut the substrate, a sharp cutting edge is achieved without applying stress. - A powerful dust collection system ensures minimal debris attachment to the substrate. - No water is required, eliminating the need for water supply and drainage facilities, making it environmentally friendly and reducing running costs. - The substrate is fixed using a substrate receiving jig and vacuum suction, eliminating the need for UV tape, etc. - The blade can be selected based on the substrate for optimal performance. → GC grinding stone, diamond disk, metal saw - Four-axis control enables high-precision cutting. - Equipped with image recognition (CCD camera) as standard for high-precision cutting. - Standard features include detection of blade damage and wear. Safe cutting is possible with static elimination blow. - Various operations can be performed via PC, and guidance is displayed on the monitor in case of errors. ● For more details, please download the catalog or contact us.