Batch-type plasma processing device WPA-600S
A sequencer that is low-cost yet equipped with high performance, capable of managing various assembly conditions and offering excellent cost performance.
We have adopted a compact power matching method, achieving faster plasma matching. By reducing the matching time, we have minimized charge-up damage to the device during plasma ignition. Additionally, we have achieved space-saving design with only the PUMP outside of the main unit.
basic information
【Specifications】 ○ Processing Method: Coaxial Barrel Type ○ Processing Chamber: Cylindrical, Vertical, Quartz Chamber ○ RF Power Supply: 600–2000W, 13.56MHz, Auto-Tuning ○ Processing Gas: O2, 1 additional line can be added (optional) ○ Purge Gas: N2 ○ Processing Steps: 10 recipes (3 steps) + 10 heater recipes ○ Wafer Size ● For other functions and details, please contact us.
Price information
Please feel free to contact us.
Delivery Time
Applications/Examples of results
【Applications】 ○ Ash removal with low damage (ashing) ○ Surface modification ○ Usable for various other process applications ● For other functions and details, please contact us.
