Batch-type plasma cleaner PT-655S
This product is a parallel plate type plasma treatment device.
This product is a parallel plate type plasma treatment device. With just the operation on the control panel, you can switch between two plasma modes: DP (Direct Plasma) mode and RIE (Reactive Ion Etching) mode, making it suitable for various process applications such as improving adhesion and sealing in die attach during assembly processes like BGA.
basic information
【Specifications】 ○ Processing Method: Parallel Plate Plasma Excitation Method (DP/RIE switchable) ○ Processing Chamber: Made of Aluminum (A5052) ○ Number of Stages: Standard 3 Stages (Optional: Can add 1 more stage) ○ Chamber Dimensions: Width 500 × Depth 580 × Height 500 mm ○ Stage Dimensions: Width 340 × Depth 420 mm ○ RF Power Supply: 600W, 13.56 MHz, Auto Tuning ○ Processing Gases: O2, Ar (Optional: Can add 1 line) ○ Purge Gas: N2 (with slow line) ○ Processing Steps: 10 Recipes (3 Steps) ○ Vacuum Pump: Rotary Pump 1300 L/min ○ Main Unit Dimensions: Width 880 × Depth 880 × Height 1600 mm ○ Main Unit Weight: Approximately 400 kg ● For other functions and details, please contact us.
Price information
Please feel free to contact us.
Delivery Time
Applications/Examples of results
【Applications】 ○ Surface modification of plastic packaging, hybrid ICs, etc. ○ Photoresist etching ○ Surface modification of fibers and polymer materials ● For other functions and details, please contact us.
