LED laser device
Introducing a laser device for LEDs that utilizes solid-state laser light and is capable of processing substrates for LEDs and LDs!
We would like to introduce the "Laser Device for LED" handled by Seishin Shoji Co., Ltd. This product is designed for processing substrates for LEDs and LDs using solid laser light (ablation, laser lift-off, etc.). The target work size is up to 4 inches, and it is equipped with processing position alignment functionality and work thickness correction functionality. It is compatible with sapphire, gallium nitride, and silicon carbide. 【Standard Specifications】 ■ Target work size: Up to 4 inches ■ Transport robot ■ Processing position alignment functionality ■ Work thickness correction functionality ■ Laser output management functionality *For more details, please refer to the related link page or feel free to contact us.
basic information
【Specifications】 ■Laser Wavelength: 355nm, 266nm ■Operating Speed: 400mm/s ■Positioning Accuracy: ±5μm or less ■Number of Work Sets: 24 pieces *For more details, please refer to the related link page or feel free to contact us.
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Applications/Examples of results
【Supported Substrate Materials】 ■ Sapphire, Gallium Nitride, Silicon Carbide *For more details, please refer to the related link page or feel free to contact us.
