McDermid: Introduction to Low Melting Point Solder Paste
Reduce the incidence of HIP and NWO defects! Features of low melting point solder paste are included.
In this document, we introduce "Low Melting Point Solder Paste." It includes sections on "Features of Low Melting Point Solder Paste and Total Cost Reduction" and "Introduction to the Bulk Reflow Process (Paste in Hole: P.I.H)." Additionally, we explain "Drop Impact Resistance Comparison Data" using graphs. Please feel free to download and take a look. 【Contents】 ■ Features of Low Melting Point Solder Paste and Total Cost Reduction ■ Introduction to the Bulk Reflow Process (Paste in Hole: P.I.H) ■ Details of the P.I.H Process ■ Product Lineup Introduction / Drop Impact Resistance Comparison Data ■ Summary *For more details, please refer to the PDF document or feel free to contact us.
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【Product Lineup】 ■Sn42/Bi57.6/Ag0.4 CVP520 ■SBX02 OM535 ■HRL1 OM550 *For more details, please refer to the PDF document or feel free to contact us.
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McDermid Performance Solutions Japan Co., Ltd.
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For more details, please refer to the PDF document or feel free to contact us.
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