McDermid "HiTech Resin Products" Corner Bond, etc.
Introducing products such as one-component thermosetting resins, one-component types, medium temperature range, and fast thermosetting options!
Seiwa Co., Ltd. handles "HiTech resin products" manufactured by McDermid. Founded in 1872, this American manufacturer has a global network and a wide adoption record under unified quality standards worldwide. In Japan, we also have a lab in Kanagawa (Hiratsuka) that supports everything from prototype condition setting to after-sales service after mass production begins, allowing customers to utilize various facility equipment themselves. Our product lineup includes epoxy materials for dispensing at BGA edges and corners called "Corner Bond," as well as one-component types, medium-temperature, and fast-curing "Potting Agents." "Underfill" is suitable for protecting solder joints of BGA, CSP, and flip-chip components. For more details, please refer to the related catalog. 【Product Types (Partial)】 ■ Underfill: High-speed penetration, thermal cycle resistance, etc. ■ Corner Bond: Adhesion at edges and corners ■ Potting Agent: Prevents cracks in small components *For more information, please refer to the PDF materials or feel free to contact us.
basic information
【Product Lineup】 <Underfill> ■ALPHA HiTech CU31-2030 ■ALPHA HiTech CU21-3240 ■ALPHA HiTech CU13-3150 <Corner Bond> ■ALPHA HiTech CF31-4010 ■ALPHA HiTech CF12-4485B <Potting Compounds> ■ALPHA HiTech 4210 Series *For more details, please refer to the PDF document or feel free to contact us.*
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Model number/Brand name
McDermid Performance Solutions Japan, Inc.
Applications/Examples of results
For more details, please refer to the PDF document or feel free to contact us.
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