McDarmid Power Electronics Argomax
Apply sintering binders and sintering processes! This can dramatically expand design possibilities.*
Established in 1872, this American manufacturer has a global network and a wide range of adoption records based on world unified quality standards. In Japan, we also have a lab in Kanagawa (Hiratsuka) that supports everything from prototype condition setting to after-sales service after mass production begins, allowing customers to utilize various facility equipment themselves. "Power Electronics" is a sintering process solution using "Argomax" aimed at significantly improving power cycle test performance. By applying sintering adhesives and the sintering process, it is possible to dramatically expand the design possibilities of our products. Using film-type products, sintering adhesives can be transferred to chips and clips. 【Features】 ■ Enables sintering at low pressure through the application of unique nanotechnology ■ Allows bonding of packages and coolers using flat dispense methods ■ Enables transfer of sintering adhesives at the wafer level using film-type products ■ In preform-type products, the bonding thickness can be customized ■ Sintering onto solid copper substrates is possible *For more details, please refer to the PDF materials or feel free to contact us.
basic information
【Argomax Product Lineup】 ■DAS: Die Attach ■TAS: Chip-on-Board Bonding ■PAS: Package Bonding ■WAS: Wafer-Level Sintering Adhesive *For more details, please refer to the PDF document or feel free to contact us.
Price range
Delivery Time
Model number/Brand name
McDermid Performance Solutions Japan Co., Ltd.
Applications/Examples of results
Alpha Argomax sintering adhesive enables the manufacturing of SiC/GaN power modules/devices with a Tjmax of over 200°C, contributing to improved reliability of chip bonding and overall cost reduction. It is ideal for inverters aimed at hybrid vehicles, EVs, power transmission, railways, and more. It can also accommodate lead-free high-reliability bonding. *For more details, please refer to the PDF document or feel free to contact us.